Product category:OSP,HASL,Plated Gold, Immersion gold/Tin/silver, impedance control,golden finger.
>>> Layers:2-12 L
>>> Base material: FR-4,CEM-3，Rogers, Halogen-free ,High TG
>>> Thickness of board: 0.2mm-3.0mm
>>> Max processing dimensions:700mm*600mm
>>> Thickness of base copper foil : 18u, 35u, 70u
>>> Finished copper thichness: 4OZ(inner layer and outer layer)
>>> Min holes diameter :0.20mm
>>> Min line width: 0.10mm
>>> Min line space: 0.10mm
>>> Solder mask: liquid photo-imageable(LPI) solder mask and thermosetting solder mask(Green,Yellow,Red,Black,Blue)
>>> Profiling Method: Punch, CNC, Handset, V-cut, trimming
>>> Tolerence: Line width±20%, Holedia±3mil, Profiling±0.13mm(lexcept special technic)
>>> Thickness of plating layer:
Flash gold board: Ni layer: 2.5-5um , Au layer:0.02-0.1um
Immersion gold board: Ni layer:2.5-5um, Au layer:0.1-0.2um
Gold finger board: Ni layer:2.5-5um ,Au layer:0.1-0.2um
>>> Twist and wrap:≤0.8%
inspection standard: underIPC-600F class -Ⅱ or customer’s requirement